31 May / 2017

BGA Rework Using StikNPeel(TM) Stencil

Demonstration of BGA rework via stencil printing. BEST’s StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print volume underneath he aperture locations.

For more information visit the BGA Rework & StikNPeel website pages below:

BGA Rework: http://www.solder.net/services/bga-rework
StikNPeel: http://www.solder.net/products/stiknpeel

Visit site for the number 1 printing services and printing companies in NYC

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